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ST-388-2BG026-6
Emulation Technology
ST-388-2BG026-6

10 of BGA Rework Stencils. Ball Count 388. Grid Size & Ball Pattern 26 x 26, P4-Row, +6 x 6 center. These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac Stencils are easy to use and leave no residue on the board surface.

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Tedss2098000531美国-1CNY*登录后可查看详细价格car 联系客服
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Newark18C0803美国-1CNY*登录后可查看详细价格car 联系客服
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Newark34C5640美国-5CNY*登录后可查看详细价格car 联系客服
BPW-3082BG020-30
Emulation Technology
BPW-3082BG020-30

308 Pin BGA Screw Lock Sockets Surface Mount & Thru Hole (up to 3 GHz Bandwidth). Easily exchange chips in your system without soldering and desoldering. Perfect for bring up boards and debug projects. Low inductance of <2 nH. Sockets adapt to all package styles (down to 0.50mm pitch) Ceramic & plastic BGA (cavity up & down), CSP, LGA, CGA, PSGA. Same PCB layout as the chip (no Holes required for SMD socket).

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CLIP-056-TS01-KIT
Emulation Technology
CLIP-056-TS01-KIT

IC Socket Test CLip .Number of Contacts:56. Leaded Process Compatible:No. Peak Reflow Compatible (260 C)

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