| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage (Vrms) | 3750 |
| PCB changed | 5 |
| Output Type | Totem-Pole |
| ECCN (US) | EAR99 |
| Standard | CSA|UL|cUL |
| Maximum Power Dissipation (mW) | 20 |
| Direction Type | Uni-Directional |
| Typical Rise Time (us) | 0.003 |
| Maximum Data Rate | 15MBd(Typ) |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Package | SO |
| Typical Forward Voltage (V) | 1.5 |
| Package Height | 2.1 |
| Polarity | Inverting |
| Maximum Reverse Voltage (V) | 5 |
| EU RoHS | Compliant |
| Maximum Forward Current (mA) | 10 |
| Maximum Forward Voltage (V) | 1.65 |
| Minimum Forward Voltage (V) | 1.35 |
| Maximum Propagation Delay Time (ns) | 80 |
| Logic Gate Type | NAND Schmitt |
| Typical Fall Time (us) | 0.003 |
| Package Length | 3.7 |
| Standard Package Name | SOP |
| Pin Count | 5 |
| Mounting | Surface Mount |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Maximum Continuous Output Current (mA) | 10 |
| Packaging | Tape and Reel |
| Package Width | 4.55 |
