Number of Channels per Chip | 6 |
Number of Output Enables per Chip | 0 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 20@4.5V|17@6V|100@2V |
PCB changed | 16 |
HTS | 8542.39.00.01 |
Maximum Quiescent Current (uA) | 2 |
Number of Elements per Chip | 6 |
ECCN (US) | EAR99 |
Maximum Power Dissipation (mW) | 500 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | SOIC |
Maximum High Level Output Current (mA) | -5.2 |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 150 |
Propagation Delay Test Condition (pF) | 150 |
Logic Function | Buffer/Converter |
Package Height | 1.38 |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 6 |
EU RoHS | Compliant |
Number of Inputs per Chip | 6 |
Number of Outputs per Chip | 6 |
Package Length | 10.2(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 5.2 |
Pin Count | 16 |
Mounting | Surface Mount |
Number of Input Enables per Chip | 0 |
Input Signal Type | Single-Ended |
Bus Hold | No |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 5 |
Logic Family | HC |
Package Width | 3.9 |
Minimum Operating Supply Voltage (V) | 2 |