| Maximum Propagation Delay Time @ Maximum CL (ns) | 4.3@3.3V|3.3@5V |
| PCB changed | 8 |
| Output Type | Push-Pull |
| Maximum Quiescent Current (uA) | 10 |
| Number of Elements per Chip | 2 |
| ECCN (US) | EAR99 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Package | SSOP |
| Maximum High Level Output Current (mA) | -32 |
| Process Technology | CMOS |
| Absolute Propagation Delay Time (ns) | 8.6 |
| Propagation Delay Test Condition (pF) | 50 |
| Logic Function | NAND |
| Package Height | 1.2(Max) |
| Number of Element Outputs | 1 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| EU RoHS | Compliant |
| Number of Selection Inputs per Element | 0 |
| Number of Element Inputs | 2-IN |
| Supplier Temperature Grade | Commercial |
| Package Length | 3.15(Max) |
| Standard Package Name | SOP |
| Maximum Low Level Output Current (mA) | 32 |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Number of Output Enables per Element | 0 |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 5|3.3|2.5|1.8 |
| Logic Family | LVC |
| Package Width | 2.9(Max) |
| Minimum Operating Supply Voltage (V) | 1.65 |
