| Contact Mating Area Plating Material | Gold |
| Socket Type | LGA 2011 |
| Circuit Application | Signal |
| Housing Material | High Temperature Thermoplastic |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | - |
| Tray Color | Blue |
| Plating Thickness | 15 |
| Contact Base Material | Copper Alloy |
| Grid Spacing | 1.016 x .8814 |
| Connector System | Board-to-Board |
| Contact Current Rating (Max) | .5 |
| TE Internal Number | 1554653-1 |
| グリッドのスペーシング | .040 x .0347 |
| Connector Mounting Type | Board Mount |
| Comment | Lead-Free Solderball |
| Number of Positions | 2011 |
| End Node Category | LGA Sockets |
| PCB Mounting Style | Surface Mount Solder Ball |
| Operating Temperature Range | -25 – 100 |
| UL Flammability Rating | UL 94V-0 |
| Centerline (Pitch) | 1.016 |
| Plating Material | Gold |
| Brand | TE Connectivity |
| Product Type | Socket |
| Contact Mating Area Plating Thickness | 15 |
| Housing Color | Black |
| Packaging Method | Tray |
| Frame Style | Square |
| Heat Sink Attachment | Without |
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