| Contact Mating Area Plating Material | Gold Flash over Palladium Nickel |
| Industry Standard | USB 2.0 |
| Circuit Application | Power & Signal |
| Housing Material | PA 9T GF |
| Size | Mini |
| Connector & Contact Terminates To | Printed Circuit Board |
| Ground Component Type | - |
| Sealable | - |
| Number of Mounting Legs | - |
| Contact Current Rating (Max) | 1 |
| Mating Cycles (Max) | 5000 |
| Lock Device Color | - |
| PCB Thickness (Recommended) | 1.57 |
| Packaging Quantity | 150 |
| Tail Length | 1.15 |
| Connector Mounting Type | Board Mount |
| Application Method | - |
| End Node Category | USB Connectors |
| UL Flammability Rating | UL 94V-0 |
| Orientation | Right Angle |
| Offset | 0 |
| Brand | AMP |
| Grounding Options | - |
| Product Type | Connector |
| Contact Mating Area Plating Thickness | .76 |
| Connector Style | Receptacle |
| PCB Mount Retention Type | SMT Hold-Down |
| Panel Mount Feature Type | - |
| USB Version | 2 |
| Termination Method | Solder |
| Contact Termination Type | Surface Mount |
| Connector System | Cable-to-Board |
| TE Internal Number | 1-1734035-1 |
| Number of Ports | 1 |
| Moisture Sensitivity Level | 1 |
| Degree of Protection | - |
| PCB Connector Seating | Flush |
| Shell Plating Material | Nickel |
| Comment | - |
| Number of Positions | 5 |
| USB Type | B |
| Panel Ground Location | - |
| Pick & Place Capable | No |
| Operating Temperature Range | -40 – 85 |
| Pick and Place | - |
| Centerline (Pitch) | .8 |
| LED | Without |
| Shell Plating Finish | - |
| Termination Method to Printed Circuit Board | Reflow Solder |
| Integral Locking Latch | Without |
| Locking Feature | With |
| Locating Posts | Without |
| Halogen Free | No |
| Housing Color | Black |
| Packaging Method | Tray |
| Mounting Location | Top |
| Soldering Temperature (Max) | 500 |
| Test Identification (TID) | - |
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