Number of Channels per Chip | 1 |
Maximum ESD Protection Voltage (kV) | 3(Min)@HBM |
Minimum Common Mode Rejection (kV/us) | 20 |
Minimum Isolation Voltage (Vrms) | 5000 |
PCB changed | 6 |
HTS | 8542.39.00.01 |
Output Type | Open Drain |
ECCN (US) | EAR99 |
Maximum Power Dissipation (mW) | 140 |
Maximum Data Rate | 15Mbps |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 20 |
Supplier Package | SPID SMD |
Maximum Output Current Drive (mA) | 75 |
Package Height | 2.05(Min) |
Maximum Operating Supply Voltage (V) | 30 |
EU RoHS | Compliant |
Maximum Working Insulation Voltage | 1140Vp |
Maximum Rise Time (ns) | 15(Typ) |
Maximum Propagation Delay Time (tPHL) (ns) | 60 |
Maximum Fall Time (ns) | 5(Typ) |
Package Length | 4.58 |
Standard Package Name | SPID SMD |
Pin Count | 6 |
Forward/Reverse Channels | 1/1 |
Mounting | Surface Mount |
Type | General Purpose |
Coupling Type | Capacitive Coupling |
Part Status | Active |
Minimum Pulse Width (ns) | 66 |
Packaging | Tape and Reel |
Maximum Propagation Delay Time (tPLH) (ns) | 60 |
Package Width | 7.5 |
Maximum Propagation Delay Skew (ns) | 20 |
Minimum Operating Supply Voltage (V) | 3 |