| Number of Channels per Chip | 1 |
| Maximum ESD Protection Voltage (kV) | 3(Min)@HBM |
| Minimum Common Mode Rejection (kV/us) | 20 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| PCB changed | 6 |
| HTS | 8542.39.00.01 |
| Output Type | Open Drain |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 140 |
| Maximum Data Rate | 15Mbps |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Maximum Pulse Width Distortion (ns) | 20 |
| Supplier Package | SDIP SMD |
| Package Height | 2.05(Min) |
| Maximum Operating Supply Voltage (V) | 30 |
| EU RoHS | Compliant |
| Maximum Working Insulation Voltage | 1140Vp |
| Maximum Rise Time (ns) | 15(Typ) |
| Maximum Propagation Delay Time (tPHL) (ns) | 60 |
| Maximum Fall Time (ns) | 5(Typ) |
| Package Length | 4.58 |
| Standard Package Name | DIP |
| Pin Count | 6 |
| Forward/Reverse Channels | 1/1 |
| Mounting | Surface Mount |
| Type | General Purpose |
| Coupling Type | Capacitive Coupling |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Minimum Pulse Width (ns) | 66 |
| Packaging | Tube |
| Maximum Propagation Delay Time (tPLH) (ns) | 60 |
| Package Width | 7.5 |
| Maximum Propagation Delay Skew (ns) | 20 |
| Minimum Operating Supply Voltage (V) | 3 |
