| Program Memory Type | Flash |
| Package Width (mm) | 3.67 |
| Number of Timers | 14 |
| ADC Resolution | 12/12/12 |
| Data Bus Width (bit) | 32 |
| Device Core | ARM Cortex M3 |
| SPI | 3 |
| Minimum Operating Temperature (°C) | -40 |
| ADC Channels | 16/16/16 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | WLCSP |
| 印刷电路板已变更 | 66 |
| Instruction Set Architecture | RISC |
| Core Architecture | ARM |
| Family Name | STM32 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Clock Rate (MHz) | 120 |
| Number of Programmable I/Os | 51 |
| Package Height (mm) | 0.38 |
| I2C | 3 |
| Interface Type | CAN/I2C/I2S/SPI/UART/USART/USB |
| Maximum CPU Frequency (MHz) | 120 |
| Number of ADCs | Triple |
| USB | 2 |
| RAM Size | 132KB |
| UART | 2 |
| I2S | 2 |
| DAC Channels | 2/2 |
| CECC Qualified | No |
| Standard Package Name | BGA |
| Pin Count | 66 |
| DAC Resolution | 12/12 |
| Mounting | Surface Mount |
| CAN | 2 |
| USART | 4 |
| 欧盟限制某些有害物质的使用 | Compliant |
| Package Length (mm) | 4.01 |
| Lead Shape | Ball |
| Ethernet | 0 |
| Packaging | Tape and Reel |
| Program Memory Size | 1024KB |
| Typical Operating Supply Voltage (V) | 2.5|3.3 |
| Number of DACs | Dual |
| Programmability | Yes |
| Minimum Operating Supply Voltage (V) | 1.8 |
