Number of Channels per Chip | 1 |
Minimum Isolation Voltage (Vrms) | 5000 |
PCB changed | 4 |
Output Type | DC |
Maximum Collector-Emitter Voltage (V) | 80 |
ECCN (US) | EAR99 |
Current Transfer Ratio Test Current (mA) | 5 |
Standard | UL |
Maximum Power Dissipation (mW) | 150/ch |
Typical Rise Time (us) | 3 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 100 |
Supplier Package | PDIP SMD |
Maximum Collector-Emitter Saturation Voltage (mV) | 300 |
Typical Forward Voltage (V) | 1.17 |
Package Height | 3.5 |
Maximum Reverse Voltage (V) | 6 |
Maximum Current Transfer Ratio (%) | 600 |
Maximum Forward Current (mA) | 80 |
Output Device | Transistor |
Maximum Forward Voltage (V) | 1.4 |
Input Type | DC |
Maximum Collector Current (mA) | 50/ch |
Typical Fall Time (us) | 5 |
Package Length | 4.6 |
Standard Package Name | DIP |
Pin Count | 4 |
Mounting | Surface Mount |
Minimum Current Transfer Ratio (%) | 300 |
Packaging | Tape and Reel |
Package Width | 6.5 |