TSSELECTRODEEVM 规格参数
| Core Architecture: | ColdFire |
| Weight (kg): | .398707 |
| SVHC: | No SVHC (17-Dec-2015) |
| Core Sub-Architecture: | ColdFire v1 |
| For Use With: | 9S08 and ColdFire V1 Families Demo Boards |
| Kit Contents: | Daughter Board, DVD Containing Documentation & Guide |
| Tariff No: | 84733080 |
| Silicon Manufacturer: | NXP |
| RoHS Compliant: | Yes |
| Country of Origin: | United States Country in which last significant manufacturing process was carried out |