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| Core Processor | S08 |
| PCN Assembly/Origin | Process Change 09/Nov/2016 |
| Program Memory Type | FLASH |
| Online Catalog | S08 |
| Supplier Device Package | 64-LQFP (10x10) |
| PCN Design/Specification | Gold to Copper Wire 31/Jul/2013 Mold Compound Chg 21/Dec/2015 |
| EEPROM Size | 2K x 8 |
| Package / Case | 64-LQFP |
| PCN Packaging | 12NC 27/Nov/2016 |
| Manufacturer | NXP USA Inc. |
| Design Resources | Development Tool Selector |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V |
| Other Names | 935324263557 |
| Speed | 40MHz |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Datasheets | MC9S08DZ60,48,32,16 MC9S08DZ60 Datasheet Addendum 840F-02 Pkg Drawing |
| Categories | Integrated Circuits (ICs) |
| RAM Size | 4K x 8 |
| Number of I/O | 53 |
| Product Training Modules | S08D 8-Bit Microcontroller |
| Peripherals | LVD, POR, PWM, WDT |
| EDA / CAD Models | Download from Ultra Librarian |
| Oscillator Type | External |
| Standard Package | 800 |
| Series | S08 |
| Core Size | 8-Bit |
| Packaging | Tray |
| Part Status | Active |
| Connectivity | CAN, I²C, LIN, SCI, SPI |
| Program Memory Size | 60KB (60K x 8) |
| Data Converters | A/D 24x12b |
