Organization | 64Mx16 |
PCB changed | 96 |
HTS | 8542.32.00.32 |
ECCN (US) | EAR99 |
Data Bus Width (bit) | 16 |
Number of Internal Banks | 8 |
Operating Current (mA) | 180 |
Address Bus Width (bit) | 16 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 95 |
Supplier Package | FBGA |
DRAM Type | DDR3 SDRAM |
Chip Density (bit) | 1G |
Number of Words per Bank | 8M |
Package Height | 0.8 |
Maximum Operating Supply Voltage (V) | 1.575 |
Maximum Clock Rate (MHz) | 1333 |
EU RoHS | Compliant |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Commercial |
Package Length | 14 |
Standard Package Name | BGA |
Pin Count | 96 |
Mounting | Surface Mount |
Lead Shape | Ball |
Part Status | Obsolete |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 1.5 |
Package Width | 8 |
Minimum Operating Supply Voltage (V) | 1.425 |