| Peak Pulse Power Dissipation (W) | 600 |
| Configuration | Single |
| PCB changed | 2 |
| HTS | 8541.10.00.80 |
| Number of Elements per Chip | 1 |
| ECCN (US) | EAR99 |
| Minimum Breakdown Voltage (V) | 6.4 |
| Maximum Reverse Leakage Current (uA) | 800 |
| Direction Type | Uni-Directional |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Peak Pulse Current (A) | 65.3 |
| Maximum Operating Temperature (°C) | 150 |
| Peak Forward Surge Current (A) | 100 |
| Supplier Package | SMB |
| Junction Capacitance Curve | http://download.siliconexpert.com/pdfs/2015/8/17/7/55/48/151/ltf_/manual/3.3.jpg |
| Pulse Derating Curve | http://download.siliconexpert.com/pdfs/2015/8/18/0/16/38/760/ltf_/manual/3.4.jpg |
| Package Height | 2.41(Max) |
| EU RoHS | Compliant with Exemption |
| Test Current (mA) | 10 |
| Maximum Forward Voltage (V) | 3.5 |
| Maximum Reverse Stand-Off Voltage (V) | 5 |
| Package Length | 4.75(Max) |
| Standard Package Name | DO-214-AA |
| Pin Count | 2 |
| Mounting | Surface Mount |
| Pulse Power Rating Curve | http://download.siliconexpert.com/pdfs/2015/8/17/7/55/38/292/ltf_/manual/3.1.jpg |
| Operating Junction Temperature (°C) | -65 to 150 |
| Pulse Waveform Curve | http://download.siliconexpert.com/pdfs/2015/8/17/7/55/42/917/ltf_/manual/3.2.jpg |
| Lead Shape | J-Lead |
| Part Status | Active |
| Power Dissipation Derating Curve | http://download.siliconexpert.com/pdfs/2015/8/17/7/56/2/729/ltf_/manual/3.5.jpg |
| Packaging | Tape and Reel |
| Maximum Clamping Voltage (V) | 9.2 |
| Package Width | 3.94(Max) |
