| Peak Pulse Power Dissipation (W) | 1500 |
| Configuration | Single |
| PCB changed | 2 |
| HTS | 8541.10.00.80 |
| Number of Elements per Chip | 1 |
| ECCN (US) | EAR99 |
| Minimum Breakdown Voltage (V) | 19 |
| Maximum Reverse Leakage Current (uA) | 1 |
| Direction Type | Uni-Directional |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Peak Pulse Current (A) | 54.9 |
| Maximum Operating Temperature (°C) | 175 |
| Peak Forward Surge Current (A) | 200 |
| Supplier Package | DO-201 |
| Junction Capacitance Curve | http://download.siliconexpert.com/pdfs/2018/1/28/3/37/24/613/ltf_/manual/junctioncapacitancecurve.jpg |
| Pulse Derating Curve | http://download.siliconexpert.com/pdfs/2018/1/28/1/10/8/729/ltf_/manual/pulsederatingcurve.jpg |
| Product Weight (g) | 1.2 |
| EU RoHS | Compliant with Exemption |
| Test Current (mA) | 1 |
| Maximum Forward Voltage (V) | 5 |
| Diameter | 5.3(Max) |
| Maximum Reverse Stand-Off Voltage (V) | 17.1 |
| Package Length | 9.5(Max) |
| Standard Package Name | DO-201 |
| Pin Count | 2 |
| Mounting | Through Hole |
| Pulse Power Rating Curve | http://download.siliconexpert.com/pdfs/2018/1/28/1/10/10/850/ltf_/manual/pulsepowerratingcurve.jpg |
| Operating Junction Temperature (°C) | -55 to 175 |
| Pulse Waveform Curve | http://download.siliconexpert.com/pdfs/2018/1/28/1/10/12/348/ltf_/manual/pulsewaveformcurve.jpg |
| Lead Shape | Through Hole |
| Part Status | Active |
| Power Dissipation Derating Curve | http://download.siliconexpert.com/pdfs/2018/1/28/1/10/5/812/ltf_/manual/powerdissipationderatingcurve.jpg |
| Packaging | Tape and Reel |
| Maximum Clamping Voltage (V) | 27.7 |