| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| PCB changed | 8 |
| HTS | 8541.40.80.00 |
| Output Type | DC |
| ECCN (US) | EAR99 |
| Current Transfer Ratio Test Current (mA) | 16 |
| Standard | CSA|IEC|UL|DIN|EN |
| Maximum Power Dissipation (mW) | 100 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Data Rate | 1MBd(Typ) |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Package | DIP SMD |
| Typical Forward Voltage (V) | 1.45 |
| Package Height | 3.5 |
| Maximum Reverse Voltage (V) | 5 |
| EU RoHS | Compliant |
| Maximum Current Transfer Ratio (%) | 50 |
| Maximum Forward Current (mA) | 25 |
| Output Device | Transistor With Base |
| Maximum Forward Voltage (V) | 1.7 |
| Input Type | DC |
| Maximum Collector Current (mA) | 8 |
| Package Length | 9.68 |
| Standard Package Name | DIP |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Minimum Current Transfer Ratio (%) | 19 |
| Lead Shape | Gull-wing |
| Part Status | Unconfirmed |
| Packaging | Tape and Reel |
| Package Width | 6.5 |
