| Number of Channels per Chip | 2 |
| Power Supply Type | Dual |
| PCB changed | 20 |
| Maximum Input Offset Voltage (mV) | 50@-3V@12V |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 670 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | TSSOP |
| Process Technology | CMOS |
| Package Height | 1.05(Max) |
| Maximum Operating Supply Voltage (V) | ±9 |
| EU RoHS | Compliant |
| Maximum Dual Supply Voltage (V) | ±9 |
| Maximum Propagation Delay Time (ns) | 15 |
| Maximum Input Bias Current (uA) | 0.025@-3V@12V |
| Supplier Temperature Grade | Industrial |
| Package Length | 6.6(Max) |
| Minimum Dual Supply Voltage (V) | ±5 |
| Standard Package Name | SOP |
| Maximum Supply Current (mA) | 25@12V/-25(Min)@-3V |
| Pin Count | 20 |
| Mounting | Surface Mount |
| Typical Dual Supply Voltage (V) | ±7.5 |
| Lead Shape | Gull-wing |
| Part Status | Obsolete |
| Manufacturer Type | High Speed Comparator |
| Package Width | 4.5(Max) |
