| Device Core Size | 32(b) |
| Instruction Set Architecture | RISC |
| Operating Temp Range | 0C to 125C |
| Operating Temperature Classification | Commercial |
| Operating Temperature (Min) | 0C |
| Rad Hardened | No |
| Device Core | e500 |
| Pin Count | 561 |
| Mounting | Surface Mount |
| Package Type | TEBGA I |
| Packaging | Tray |
| Frequency | 533(MHz) |
| Operating Temperature (Max) | 125C |
