| Fabrication Technology | CMOS |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 23@5V |
| PCB changed | 14 |
| Maximum Quiescent Current (uA) | 1 |
| Number of Elements per Chip | 4 |
| Package Width (mm) | 4.4 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | TSSOP |
| Maximum High Level Output Current (mA) | -4.8 |
| Absolute Propagation Delay Time (ns) | 29 |
| Propagation Delay Test Condition (pF) | 50 |
| Logic Function | NAND |
| Number of Element Outputs | 1 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Package Height (mm) | 0.9 |
| EU RoHS | Compliant |
| Number of Selection Inputs per Element | 0 |
| Number of Element Inputs | 2-IN |
| Standard Package Name | SOP |
| Maximum Low Level Output Current (mA) | 4.8 |
| Pin Count | 14 |
| Mounting | Surface Mount |
| Number of Output Enables per Element | 0 |
| Package Length (mm) | 5 |
| Lead Shape | Gull-wing |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 5 |
| Logic Family | HCT |
| Minimum Operating Supply Voltage (V) | 4.5 |
