| Program Current (mA) | 60 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 50 |
| Supplier Package | Fortified BGA |
| Chip Density (bit) | 32M |
| Timing Type | Asynchronous |
| Maximum Operating Supply Voltage (V) | 3.6 |
| EU RoHS | Compliant |
| Sector Size | 64Kbyte x 64 |
| Number of Words | 4M/2M |
| Erase Suspend/Resume Modes Support | Yes |
| Architecture | Sectored |
| Block Organization | Symmetrical |
| OE Access Time (ns) | 25 |
| Minimum Endurance (Cycles) | 100000 |
| Supplier Temperature Grade | Industrial |
| Standard Package Name | BGA |
| Cell Type | NOR |
| Pin Count | 64 |
| Mounting | Surface Mount |
| Simultaneous Read/Write Support | No |
| Max. Access Time (ns) | 90 |
| Lead Shape | Ball |
| Packaging | Tray |
| Typical Operating Supply Voltage (V) | 3|3.3 |
| Programmability | Yes |
| Page Read Current (mA) | 20 |
| PCB changed | 64 |
| HTS | 8542.32.00.71 |
| ECCN (US) | 3A991.b.1.a |
| Maximum Page Access Time (ns) | 25 |
| Address Bus Width (bit) | 22/21 |
| Minimum Operating Temperature (°C) | -40 |
| Command Compatible | Yes |
| Maximum Operating Temperature (°C) | 85 |
| Process Technology | 110nm |
| Package Height | 0.6(Min) |
| Maximum Programming Time (ms) | 31500(Typ)/Chip |
| Maximum Erase Time (s) | 64/Chip |
| Interface Type | Parallel |
| Boot Block | No |
| Number of Bits/Word (bit) | 8/16 |
| ECC Support | No |
| Support of Page Mode | Yes |
| Page Size | 8Words/16byte |
| Support of Common Flash Interface | Yes |
| Package Length | 13 |
| Part Status | Active |
| Package Width | 11 |
| Minimum Operating Supply Voltage (V) | 2.7 |
