| Number of Channels per Chip | 1 |
| Power Supply Type | Dual |
| PCB changed | 8 |
| HTS | 8542.33.00.01 |
| Maximum Input Offset Voltage (mV) | 1@±5V |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 900 |
| Maximum Input Offset Current (uA) | 0.5@±15V |
| Minimum CMRR Range (dB) | 95 to 105 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Package | SOIC N |
| Process Technology | BiCOM |
| Typical Gain Bandwidth Product (MHz) | 600 |
| Typical Voltage Gain (dB) | 96.26 |
| Package Height | 1.5(Max) |
| EU RoHS | Compliant |
| Maximum Dual Supply Voltage (V) | ±18 |
| Typical Input Noise Voltage Density (nV/rtHz) | 1.7@±15V |
| Maximum Input Bias Current (uA) | 7@±5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@±15V |
| Typical Slew Rate (V/us) | 150@±5V |
| Package Length | 5(Max) |
| Minimum Dual Supply Voltage (V) | ±4.5 |
| Standard Package Name | SOP |
| Shut Down Support | No |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Type | High Speed Amplifier |
| Minimum PSRR (dB) | 98 |
| Typical Dual Supply Voltage (V) | ±12|±5|±15|±9 |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Packaging | Tube |
| Manufacturer Type | High Speed Amplifier |
| Package Width | 4(Max) |
| Typical Settling Time (ns) | 65 |
| Minimum CMRR (dB) | 100 |
