| Number of Channels per Chip | 1 |
| Power Supply Type | Dual |
| PCB changed | 8 |
| HTS | 8542.33.00.01 |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 1300 |
| Maximum Input Offset Current (uA) | 0.5@±15V |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Package | PDIP N |
| Process Technology | BiCOM |
| Typical Gain Bandwidth Product (MHz) | 750 |
| Package Height | 3.3 |
| EU RoHS | Compliant |
| Maximum Dual Supply Voltage (V) | ±18 |
| Typical Slew Rate (V/us) | 230 |
| Package Length | 9.27 |
| Minimum Dual Supply Voltage (V) | ±4.5 |
| Standard Package Name | DIP |
| Shut Down Support | No |
| Pin Count | 8 |
| Mounting | Through Hole |
| Type | High Speed Amplifier |
| Typical Dual Supply Voltage (V) | ±12|±5|±15|±9 |
| Lead Shape | Through Hole |
| Part Status | Active |
| Packaging | Tube |
| Manufacturer Type | High Speed Amplifier |
| Package Width | 6.35 |
| Typical Settling Time (ns) | 65 |
