Contact Mating Area Plating Material | Select Gold |
Industry Standard | - |
Circuit Application | Signal |
Housing Material | LCP (Liquid Crystal Polymer) |
Make First / Break Last | No |
Contact Type | Socket |
Number of Pairs | - |
Number of Power Positions | - |
Contact Base Material | Phosphor Bronze |
PCB Connector Assembly Type | PCB Mount Receptacle |
Number of Coax Positions | - |
PCB Contact Termination Area Plating Material | Tin |
Insulation Resistance | 1000 |
Solder Tail Contact Plating Material Finish | Tin: Matte |
Connector Mounting Type | Board Mount |
Mating Pin-to-PCB Dimension | - |
Locating Post Length | - |
Sealant | - |
Number of Active Positions | - |
End Node Category | Board-to-Board Headers & Receptacles |
UL Flammability Rating | UL 94V-0 |
Dielectric Withstanding Voltage | 650 |
CSA File Number | - |
Mating Post Length | - |
Termination Post Length | .107 |
Impedance | - |
Contact Layout | Inline |
Solder Process Feature | - |
Tin to Lead Ratio | - |
Profile | Standard |
Agency/Standard | - |
Connector System | Board-to-Board |
TE Internal Number | 2314822-6 |
Cover Material | - |
Number of Contacts | 6 |
Housing Entry Style | - |
Mating Alignment | Without |
Width | 4 |
Sequencing | - |
Busbar Termination Area Plating Material | - |
Number of Positions | 6 |
Operating Temperature Range | -40 – 257 |
CSA Certified | - |
PCB Contact Termination Area Plating Thickness | 3 – 5 |
PCB Mount Retention | Without |
Type | - |
Length | .2362 |
PCB Retention Feature Plating Material | - |
Busbar Material | - |
Housing Color | Black |
Underplate Material Thickness | 50 |
Post Styles | Solder Tail |
Mating Retention | - |
Post Numbers Omitted | - |
Row-to-Row Spacing | 2 |
Ground Contact Material | - |
Connector & Contact Terminates To | Printed Circuit Board |
Sealable | - |
Busbar Mating Area Plating Thickness | - |
Sealed Bottom | - |
Ground Component Type | - |
Packaging Reel Diameter | - |
Connector Contact Load Condition | - |
Boss | - |
Contact Current Rating (Max) | 2 |
Number of Center Guides | - |
Header Type | Shrouded |
Mating Alignment Type | - |
PCB Thickness (Recommended) | 1.6 |
Contact Plating Thickness | - |
Packaging Quantity | - |
PCB Mount Alignment | Without |
High Temperature Compatible | Yes |
Busbar Termination Area Plating Material Finish | - |
Tail Length | .1024 |
Differential Signaling | - |
Pairs per Column | - |
Number of Signal Positions | - |
PCB Retention Feature Material | - |
Hybrid | No |
Sealing Method | - |
Contact Mating Area Plating Material Finish | Matte |
Brand | TE Connectivity |
Number of Columns | - |
UL Rating | - |
PCB Mount Orientation | Vertical |
Product Type | Connector |
Contact Mating Area Plating Thickness | .76 |
Connector Style | Receptacle |
Terminations per Post | - |
Contact Underplating Material | Nickel |
Stackable | - |
PCB Mount Retention Type | - |
Stacking Configuration | - |
Number of Contacts Loaded | - |
Applied Pressure | - |
UL File Number | - |
Board-to-Board Configuration | Vertical |
Number of Single Ended Lines | - |
Approved Standards | - |
Pick and Place Cover | Without |
Post Size | .20 x .40 |
PCB Hole Shape | - |
Data Rate | - |
Voltage | 125 |
Busbar Mating Area Plating Material | - |
Height | 4.5 |
Contact Resistance | - |
Comment | - |
Number of Rows | 2 |
Termination Resistance | - |
For Use With | Headers |
Centerline (Pitch) | 2 |
Termination Method to Printed Circuit Board | Through Hole - Solder |
Hardware Type | - |
Contact Shape | - |
Assembly Process Feature | - |
Contact Configuration | - |
Connector Seal Type | - |
PCB Mount Alignment Type | - |
MIL-C-55032 | - |
Stack Height | - |
Stabilizers | - |
Packaging Method | Tube |
Flame Retardant | - |
Keying Slot Location | - |