Program Memory Type | Flash |
Package Width (mm) | 13 |
Number of Timers | 14 |
Data Bus Width (bit) | 32 |
Device Core | ARM Cortex M4 |
SPI | 3 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Supplier Package | MAP-BGA |
印刷电路板已变更 | 144 |
Instruction Set Architecture | RISC |
Core Architecture | ARM |
Family Name | K30 |
Maximum Operating Supply Voltage (V) | 3.6 |
Maximum Clock Rate (MHz) | 100 |
Package Height (mm) | 1.27(Max) |
I2C | 2 |
Interface Type | CAN/I2C/I2S/SPI/UART |
Maximum CPU Frequency (MHz) | 100 |
Number of ADCs | Dual |
RAM Size | 128KB |
UART | 6 |
I2S | 1 |
CECC Qualified | No |
Standard Package Name | BGA |
Pin Count | 144 |
Mounting | Surface Mount |
CAN | 2 |
欧盟限制某些有害物质的使用 | Compliant |
Package Length (mm) | 13 |
Lead Shape | Ball |
Packaging | Tray |
Program Memory Size | 256KB |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
Number of DACs | Dual |
Programmability | Yes |
Minimum Operating Supply Voltage (V) | 1.71 |