Number of Channels per Chip | 1 |
Minimum Isolation Voltage (Vrms) | 5300 |
PCB changed | 6 |
HTS | 8541.40.80.00 |
Output Type | DC |
Maximum Collector-Emitter Voltage (V) | 30 |
ECCN (US) | EAR99 |
Current Transfer Ratio Test Current (mA) | 10 |
Standard | UL |
Maximum Power Dissipation (mW) | 150 |
Typical Rise Time (us) | 2 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 100 |
Supplier Package | PDIP |
Maximum Collector-Emitter Saturation Voltage (mV) | 500 |
Typical Forward Voltage (V) | 1.3 |
Package Height | 3.81(Max) |
Maximum Reverse Voltage (V) | 5 |
EU RoHS | Compliant |
Maximum Current Transfer Ratio (%) | 30(Typ) |
Maximum Forward Current (mA) | 60 |
Output Device | Transistor With Base |
Maximum Forward Voltage (V) | 1.5 |
Input Type | DC |
Maximum Collector Current (mA) | 100 |
Typical Fall Time (us) | 2 |
Package Length | 8.7(Max) |
Standard Package Name | DIP |
Pin Count | 6 |
Mounting | Through Hole |
Minimum Current Transfer Ratio (%) | 10 |
Lead Shape | Through Hole |
Part Status | Active |
Package Width | 6.5(Max) |